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MARLOW ANNOUNCES A NEW FAMILY OF HIGH PERFORMANCE,
  LOW TEMPERATURE THERMOELECTRIC MATERIAL USING
 MICRO-ALLOY MATERIAL PROCESS

Dallas, TX - (January 31, 2002)-- Marlow Industries, Inc., announces a new family of high performance, low temperature thermoelectric material using its Micro-Alloy Materials process. This new material, termed Low Temperature MAM, provides the highest performance thermoelectric material in the world for applications operating in the 260K to 165K. Additionally, this new material has a figure of merit with performance peaks at different temperatures. This unique property allows for the customization of materials by stage of a multi-stage thermoelectric cooler (TEC) providing the lowest possible input power for CCD cooling and infrared sensor cooling applications.

Low Temperature MAM has enabled new applications for 300 milliwatt to 1.5 watt heat loads operating in the 200K to 170K range. Previously, these applications were not possible due to the high TEC input power required and the corresponding heat sinking problems. Low Temperature MAM also provides tremendous design flexibility to increase the strength of TECs by customizing the cross-sectional area of the thermoelectric pellets or columns in the upper stages of a multi-stage TEC.

With the improved thermal performance and increased strength, Low Temperature MAM will allow Marlow Industries to continue to provide the highest performing thermoelectric cooling solutions for its critical CCD and infrared sensor customers.

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