DSP QuestionnaireKeyWords:(Thermoelectric Cooler TEC Peltier)

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DSP Questionnaire

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DEFENSE, SPACE, AND PHOTONICS

Defense, Space & Photonics - Applications Questionnaire

This form is designed to collect information about you and your product in order to help Marlow engineers better serve you. If you have any problem, links are available throughout the form to assist you. Clicking any of these links will open a separate browser window. You may also download a printable version of this Application Questionnaire (.pdf format) by clicking the link below.

Download Applications Questionnaire

Customer Information

First Name:
Middle Initial:
Last Name:
Company:
Title:
Address (No. and St.):
Address 2 (Box, Ste, Apt):
City:
State:
Zip:
Email:
Phone:
Fax:

Overall TEC Dimensions

Desired

Max

Min

Tolerance

Width :

Length:

Height :

Ceramic Material

Base Ceramic:

Al₂O₃
AIN
BeO

Top Ceramic:

Al₂O₃
AIN
BeO

Operating Characteristics

Max Package (case) Temperature:	°C
Minimum cold side Temperature:	°C
Max Delta T for TEC :	+°C

External Surfaces

Top (Cold) Side:
Bare Ceramic
Cu/Ni/Au Metalization
Exterior Tinned-solder
   118°C (52In/48 Sn)
   138°C (58 Bi/42 Sn)
   146°C (97 In/3 Au)
   149°C/142°C (80 In/15 Pb/5 Ag)

Solder Thickness or volume:

Fluxless Mounting
Wire Bondable Au

Base (Hot) Side:
Bare Ceramic
Cu/Ni/Au Metalization

Exterior Tinned-solder
   118°C (52In/48 Sn)
   138°C (58 Bi/42 Sn)
   146°C (97 In/3 Au)
   149°C/142°C (80 In/15 Pb/5 Ag)

Solder Thickness or volume:
Fluxless Mounting

Electrical Requirements

Desired Typical

Max Available

Current :

Voltage*:

Power*:

Package Feed-Through Resistance:	ohms
* Measured at:	Package TEC

Heat Loads

	Active	Passive

Active:	W	W Conduction (Pigtail, wires)

End of Life Active:	W	W Convection

W Other

Total Passive

W (passive+active)

°C

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