A SUBSIDIARY OF II-VI
Laser Questionnaire<--- Laser & Telecom<--- Thermoelectric Applications<--- Technical Info<--- Home<--- 
Laser Questionnaire Your Account
HOME ABOUT MARLOW PRODUCTS TECHNICAL INFO WORLD WIDE SALES SEARCH CONTACT US SITE MAP


LASER & TELECOM

Telecom Components - Applications Questionnaire

This form is designed to collect information about you and your product in order to help Marlow engineers better serve you. If you have any problem, links are available throughout the form to assist you. Clicking any of these links will open a separate browser window. You may also download a printable version of this Application Questionnaire (.pdf format) by clicking the link below.

Download Applications Questionnaire         

Customer Information

First Name:
Middle Initial:
Last Name:
Company:
Title:
Address (No. and St.):
Address 2 (Box, Ste, Apt):
City:
State:
Zip:
Email:
Phone:
Fax:
Overall TEC Dimensions
Desired Max Min Tolerance
Width :
Length:
Height :

 
Ceramic Material
Base Ceramic: Al2O3
AIN
BeO		 Top Ceramic: Al2O3
AIN
BeO
Operating Characteristics
Max Package (case) Temperature: °C
Minimum diode Temperature: °C
Max Delta T for TEC (case-to-diode): +°C
External Surfaces
Top (Cold) Side:
Bare
Gold Flash (Cu/Ni/Au) 4-10 micro-inches thick
Thick Gold (cu/Ni/Au) 20-60 micro-inches thick
Exterior Tinned-solder
   118°C (52In/48 Sn)
   138°C (58 Bi/42 Sn)
   146°C (97 In/3 Au)
   149°C/142°C (80 In/15 Pb/5 Ag)
   183°C (63 Sn/37 Pb)
Other
   Solder Thickness
   Solder Volume     

 
Base (Hot) Side:
Bare
Gold Flash (Cu/Ni/Au) 4-10 micro-inches thick
Thick Gold (cu/Ni/Au) 20-60 micro-inches thick
Exterior Tinned-solder
   118°C (52In/48 Sn)
   138°C (58 Bi/42 Sn)
   146°C (97 In/3 Au)
   149°C/142°C (80 In/15 Pb/5 Ag)
   183°C (63 Sn/37 Pb)
Other
   Solder Thickness
   Solder Volume     

 
Electrical Requirements

 
Desired Typical Max Available
Current :
Voltage*:
Power*:

 
Package Feed-Through Resistance: ohms

* Measured at: Package  TEC
Heat Loads
 
Active
        Passive


Active:
W
W Conduction (Pigtail, wires)


End of Life Active:
W
W Convection

 
W Other

 

 
Total Passive

 

 

Total End of Life Heat Load: W (passive+active)
**Based on Delta T of: °C

Platform/Submount Dimensions

 
Width:
length:
Thickness:
Material:

Total Mounted Mass: grams

 
Lead Configuration

 
Horizontal  Vertical

Length:     

Tolerance: ± 25" typical

 
Lead Material
   Ni/Sn plated Cu buss wire
   Nickel buss wire
   Au plated Nickel wire
   Special Material

 
Leadless Design (Wire Bondable Gold Post)

    Standard (.030" x .030" x .068")
    Special
          Post Width   
          Post Length  
          Post height   


Package

 
Type of Package:
Butterfly
Longhorn
Mini-Dil
Other 		Base material:
Kovar
CuW
Ceramic

 
Reliability Requirements

 
Desired   Max
FIT Rate:

@Tcase= °C @ years

 
Select
   Only Bellcore Qualified parts
   From only MI standard TECs
   Custom TEC
   Partial Bellcore Spec (Specify)
        

TEC Internal Atmosphere
   N2
   N2 with He
   vacuum
   Non-Condensing Air
   Other


Application
   DBF Laser
   Pump Laser
   AWG
   DWDM
   Other


Desired Assembly Level for Marlow Industries
   TEC Only

   TEC Mounted in Package    - Manufacturer:
   Other

 
Program Schedule

 
Qty Date
   Samples
   Qualification Units
   Pre-Production
   Production

 
Production Requirements

If you have a price goal for the project, please specify it here.

Other Requirements/Comments

 
 
 
 
Marlow Contact Information

For more information, please contact Marlow Industries at:

10451 Vista Park Road
Dallas, Texas 75238-1645
Phone: 214-340-4900
Facsimile: 214-341-5212
 

For Defense, Space, Photonics

10451 Vista Park Road
Dallas, Texas 75238-1645
Phone: 214-340-4900
Facsimile: 214-503-3334
 

For Commercial Cooling Systems

10451 Vista Park Road
Dallas, Texas 75238-1645
Phone: 214-340-4900
Facsimile: 214-341-5212
 

For Telecom Components

10451 Vista Park Road
Dallas, Texas 75238-1645
Phone: 214-340-4900
Facsimile: 214-341-5212