Thermal Management & Equipment Enclosure Cooling
As system technology advancements increase the compactness and heat load density of electronic equipment, the need for capable thermal management becomes more critical. Whether the equipment is housed in a laboratory facility or in a remote location, the requirement for an adequate and reliable cooling solution is the same. A thermoelectric cooling solution provides for customization of size, shape and thermal range, with the added advantage of long-term reliability and without the required maintenance of a compressor system.
The II-VI Marlow thermoelectric cooling system uses state-of-the-art power control methods with its integral power supply controller. Based on pre-programmed logic, the variable controller senses temperature fluctuation detected by a temperature sensor. Based on PID (proportional integral differential logarithm) logic, this method avoids a power depleting “on”/“off” approach, and instead maintains a stabilized temperature. This control method increases the life of the thermoelectric system and provides a conservative energy solution, thereby enhancing green feature capabilities.
This thermoelectric cooling system specifically meets the challenges associated with a higher heat and humidity environment, requiring a high heat pump and low ∆T solution. Conditions within a sub 500W and 15-30° ∆T range are typically ideal for a thermoelectric equipment enclosure solution.
The latest II-VI Marlow equipment enclosure cooling solution is smaller and lighter weight than conventional thermoelectric cooling systems. It also requires less input power, improves efficiency and ∆T performance, and creates less noise. The new thermoelectric system, a patent pending thermoelectric design, exhibits these capabilities. In addition, the SLIC system is designed with ruggedized components to allow system survival and high performance in the most challenging outdoor environments.