C. TEC Mounting Methods
Thermoelectric coolers (TECs) are mounted using one of three methods: adhesive bonding, compression using thermal grease, or solder.
In general, for a TEC with a ceramic base of 19mm or less, you can solder or adhesive bond without fear of failure due to thermal stresses. If the TEC base is larger than 19mm, we recommend the compression method because thermal grease is not rigid and does not transfer thermal stresses.
A thin layer of copper metallization on the hot and/or cold ceramic allows soldering as a means of attachment. Keep in mind a TEC that has no metallization on either side cannot be mounted using solder. Adhesives and greases are prone to outgassing; therefore, they are not as appropriate for use in a vacuum package.